With the rapid development of sensor technology, sensor nodes have spread all over lighting equipment, clothing, food packaging, even inside the human body or embedded in the skin, but they must meet some challenging new requirements:
-Extremely miniaturized.
̇-Ultra low power consumption
-Ability to connect to the network
̇Applications - processing signals or data output
In addition, these next-generation sensors must be suitable for manufacturers of all types of "things" including lighting, drug delivery, door locks, meters, and traditional electronics. In many cases, manufacturers are looking for more than just sensors with different capacitors, resistors, or output voltages; they also need a “plug and play” sensor system that can be easily connected to the network and with the processor or Connected to a host such as a smartphone.
These high-performance sensor nodes, designed for digital transformation, are typically composed of three separate technology layers:
Core core sensor layer: The core sensor layer is an electronic representation of real-world phenomena such as image, optics, environment or audio.
Miniaturization and integration layer: The miniaturization and integration layer is chip-level or modular (multi-chip package) on silicon-based core sensing technology. This layer also provides an algorithm for converting raw sensor measurement data into a linear signal stream for use by the processor.
System technology layer: The system technology layer is software embedded in sensors that can be connected to the public network, such as Bluetooth Low Energy and Wi-Fi technologies.
The sensor system software also supports end-user applications, such as converting optical sensor signals in a smart wristband to measurements of heartbeats per minute. In next-generation sensor systems, each technology layer includes hardware and software, and is packaged in one package for end-product manufacturers. These tiny, networked sensors are easily integrated into the application and are therefore critical to the continued expansion of these devices.